A valuable application of thermal analysis (TEA) is for the characterization of electronic materials and components, including printed circuit boards (PCB) and encapsulants. The key properties that TEA can help address are softening temperature or Tg, completeness of cure, degree of cure, rate of cure, compositional analysis, degradation temperatures for stability assessment, expansivities, coefficients of thermal expansion, modulus (stiffness) and damping properties. PerkinElmer offers a complete line of state-of-the-art thermal analysis instruments (DSC, TGA, TMA and DMA) for the analysis and characterization of the critical thermal, physical, degradation and mechanical properties of electronic materials. The results are highly useful for research and development as well as quality assurance applications.